Kazushige Koshika, President and CEO Large-scale integration (LSI) and power semiconductors are the backbone of technological advancements shaping our world, from the ubiquitous smartphones to the innovative electric vehicles that’s revolutionizing transportation.
As the demand for more sophisticated and energy-efficient electronic devices escalates, turnkey solutions—which streamline the entire process from design to production—become increasingly critical. Yet, the turnkey approaches often struggle to balance cost-effectiveness with custom design solutions, requiring specialized expertise to enable these innovations.
This is where TOPPAN TECHNICAL DESIGN CENTER CO., LTD (TDC) shines. It distinguishes by embracing a collaborative model that is as strategic as it is pragmatic.
A horizontal functional model allows TDC to specialize in its core competencies, like analog circuit design, while leveraging the expertise of external partners for other specific tasks, such as wafer manufacturing, testing and packaging. Doing so fosters a collaborative environment that spans the entire production spectrum, ensuring each phase benefits from specialized knowledge and cutting-edge technology. Yet, delegating specific processes to these partners does not equate to TDC surrendering oversight of the production chain. On the contrary, it assumes a critical role in managing the entire supply chain, expertly coordinating among its partners to guarantee vertical integration and quality assurance of the chips.
Summing up the approach, Kazushige Koshika, President and CEO of TDC, says, “We serve as a bridge, connecting wafer fabrication to backend services, offering a comprehensive, one-stop solution for LSI design and execution.”
One of the most frequent requests from clients pertains to achieving high performance at a low cost. In response, TDC offers a finely tuned solution to balance these demands.
It’s a no-brainer to understand that seeking higher performance implies higher costs, yet TDC’s extensive network of outsourcing vendors makes it possible to choose the most appropriate (cost-efficient) process for the task, whether CMOS, bipolar, power lead semiconductor, silicon-related or other technologies. Even the backend processes are supported by collaborative relationships with a wide range of vendors, enabling TDC to choose partners based on both performance and cost considerations—something that’s rare in the field.
Equally beneficial is how TDC’s foundational strength in analog and mixed circuit design, coupled with its prowess in converting these designs into digital formats. Advanced capabilities in ARM processor design further add to its competencies, allowing for a more holistic chip design solution. This synthesis of design expertise becomes particularly advantageous for industrial clients who may not possess in-depth semiconductor design knowledge. TDC works closely with these companies, capturing their requirements, creating detailed specifications and providing regular design feedback to ensure a seamless iterative process.
We serve as a bridge, connecting wafer fabrication to backend services, offering a comprehensive, one-stop solution for LSI design and execution
A recent collaboration with a leading robotics company illustrates the application of the company’s mixed-signal capabilities. The project centered on developing a high-performance yet cost-effective controller for next-generation industrial robots—a challenge that squarely matched TDC’s core strengths. Leveraging its design capabilities, it customized a mixed-signal solution.
Throughout the project, TDC maintained robust communication with the client, regularly soliciting feedback and making necessary adjustments to the design. This iterative process was critical in not only optimizing the circuit design but balancing performance with cost considerations when selecting the manufacturing partners for the production processes.
Building on successes like this, TDC has recently broadened its turnkey services to encompass the power IC domain, reinforcing its dedication to offering end-to-end solutions within the semiconductor industry. This expansion is a strategic move that complements its existing capabilities, positioning it to address a wider range of client needs with the same level of expertise and commitment to quality.
TDC’s strategic partnership with a manufacturing giant like Taiwan Semiconductor Manufacturing Company (TSMC) through the Value Chain Alliance (VCA) program significantly enhances this agenda. The collaboration not only strengthens its purchasing power but ensures priority in wafer allocation—a crucial advantage in the competitive semiconductor market for reliable delivery of LSIs to its clients.
As one of the few design houses qualified by TSMC’s VCA, TDC takes pride in delivering innovative solutions supported by a robust and secure supply chain, solidifying its position as an industrial leader of the turn-key suppliers.
